White Papers / Tech Papers

IP Protection: Four Areas to Audit in Selecting A Contract Manufacturer

Intellectual property (IP) is the core of competitive advantage. When products are outsourced, the contract manufacturer performing the final assembly typically has access to the complete documentation package for the products they build. Where ar…

Released by: Forefront Medical Technology

Epoxies and Glass Transition Temperature

Learn about glass transition temperature (Tg) and why it is an important factor for consideration in high temperature bonding, sealing, coating and encapsulation applications. In this white paper, we explore how Tg is measured and how thermal st…

Released by: Master Bond Inc.

How to Improve Resiliency in the Medical Device Supply Chain

Supply chain breakdowns in product quality, delivery or availability are a major disruption in the medical device supply industry. In addition to adding time and cost to the device procurement process, insufficient supply of accurately performing…

Released by: Qosina Corporation

Epoxy Adhesive Films and Preforms for Electronics Manufacturing

Films and preforms offer several advantages over liquid and paste adhesives. Find out how to increase manufacturing processes with these unique adhesives.

Released by: Master Bond Inc.

What Can the Medical Device Industry Learn from the Boeing 737 MAX 8 Crashes?

By Edwin L. Bills, Consultant for Qosina

Released by: Qosina Corporation

Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing

Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives help minimize the impact of mechanical and the…

Released by: Master Bond Inc.

The Business Case for Outsourcing

When outsourcing is discussed, the conversation often centers on its benefits in terms of labor cost reduction. The reality is that labor cost reduction is often only the tip of the iceberg in terms of outsourcing benefits. That said, there are diffe…

Released by: Forefront Medical Technology

The Business Case for Outsourcing

When outsourcing is discussed, the conversation often centers on its benefits in terms of labor cost reduction. The reality is that labor cost reduction is often only the tip of the iceberg in terms of outsourcing benefits. That said, there are diffe…

Released by: Forefront Medical Technology

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic…

Released by: Master Bond Inc.

How to Choose the Ideal Ultra Engineering Polymer for Your Extruded Medical Application

by Jonathan Jurgaitis—Senior Extrusion Engineer, Apollo Medical Extrusion

Released by: Spectrum Plastics Group

Specialized Adhesives Withstand Thermal Cycling

Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applic…

Released by: Master Bond Inc.

Bonding Polyolefins The Easy Way

Polyethylene, polypropylene and related polyolefin blends and alloys have a reputation for being difficult to bond with conventional adhesives. However, advances in adhesive chemistry have made it possible to bond polyolefins effectively without the…

Released by: Master Bond Inc.

Epoxy Compounds Get Even Tougher

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is…

Released by: Master Bond Inc.

Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineer…

Released by: Master Bond Inc.

When to Use a Fast Cure Adhesive

Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, in…

Released by: Master Bond Inc.

Understanding Low Outgassing Adhesives

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What…

Released by: Master Bond Inc.

UV Curing Adhesives Shine

UV curable adhesives are among the most user friendly adhesive products on the market today—if you know how to apply them. We invite you to take a closer look at the capabilities of UV curable formulations, the requirements for an optimal cure…

Released by: Master Bond Inc.

Advanced High Performance Epoxy Adhesives Revolutionize Structural Bonding

What are the factors to consider when you need to maximize adhesive bonding performance? In this white paper, Master Bond explores the different joint designs, surface preparations, polymer types and performance properties to consider when using stru…

Released by: Master Bond Inc.

High Temperature Resistant Adhesives Beat the Heat

Selecting the right adhesive product for extreme temperature applications may seem as straightforward as reading temperature resistance values on data sheets. Some engineers will sometimes address temperature issues by simply selecting an adhesive ra…

Released by: Master Bond Inc.

Thermally Conductive Adhesives Keep Things Cool

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generatio…

Released by: Master Bond Inc.