Supreme 3HTND-2CCM has a paste consistency that flows slightly while curing. It cures readily at elevated temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. This high strength system delivers tensile lap shear, tensile and compressive strength of 1,800-2,000 psi, 6,000-7,500 psi and 15,000-17,000 psi, respectively.
This electrically insulative compound features a thermal conductivity of 10-11 BTU•in/ft2•hr•°F [1.44-1.59 W/(m·K)]. Supreme 3HTND-2CCM resists many chemicals, such as water, acids, bases, fuels and some solvents. Its inherent toughness allows it to withstand aggressive thermal cycling.
Supreme 3HTND-2CCM is serviceable over the wide temperature range of -100°F to +400°F. This epoxy has a black color and is available for use in syringe, pint, quart and gallon containers.