Butterfly Network Welcomes New Executive Team Member

Butterfly Network Inc. has hired David Horsley, Ph.D., as senior vice president of Innovation – Butterfly Embedded to scale its Ultrasound-on-Chip co-development and licensing initiative. He will lead strategy and go-to-market for Butterfly Embedded, overseeing new product development, partnerships, and commercialization efforts.

Butterfly Embedded is focused on extending the reach of the company’s proprietary semiconductor platform through co-development, licensing, and strategic collaborations with organizations developing ultrasound-enabled technologies. The program allows partners to integrate Butterfly’s core ultrasound technology into new products and applications, expanding its impact beyond the point-of-care ultrasound market.

“David combines world-class ultrasonic MEMS expertise with a track record of building commercially successful semiconductor technologies,” Butterfly Network President/Chairman/CEO Joseph DeVivo stated. “Momentum around Butterfly Embedded is increasing, with a growing pipeline of inbound demand and early collaborations beginning to contribute revenue. We’re excited to have David join at this strategic moment to build on that foundation and accelerate the next phase of growth.”

Dr. Horsley is a professor of electrical and computer engineering and co-director of the Institute for NanoSystems Innovation at Northeastern University, as well as adjunct professor of mechanical engineering at the University of California, Berkeley. He is a Fellow of both IEEE and the National Academy of Inventors and has spent his career at the intersection of semiconductor innovation and the commercialization of advanced technologies. His body of work spans MEMS, ultrasonic sensor systems, and bringing deep-technology platforms from research to market.

Dr. Horsley previously served as chief technology officer of the Emerging Sensors Business Unit at TDK InvenSense and co-founded Chirp Microsystems, a PMUT time-of-flight sensor pioneer acquired by TDK. He has also held engineering and research leadership roles at Hewlett-Packard Laboratories and Onix Microsystems, contributing to the development and commercialization of advanced MEMS and ultrasound technologies.

“Butterfly’s Ultrasound-on-Chip platform represents a unique semiconductor approach to expanding how ultrasound can be integrated into next-generation technologies,” Dr. Horsley stated. “As sensing, imaging, and computer vision become increasingly central to intelligent systems, ultrasound will play an important role in enabling new capabilities. I look forward to helping translate that innovation into scalable embedded applications and long-term growth opportunities.”

Butterfly Network Inc. is attempting to drive a digital revolution in ultrasound imaging and sensing with its proprietary Ultrasound-on-Chip semiconductor technology and software solutions. Butterfly first proved its technology in the point-of-care ultrasound market, commercializing the world’s first single-probe, whole-body portable ultrasound device, which is now on its third-generation: Butterfly iQ3. The company combines its advanced hardware with cloud software and artificial intelligence (AI), an enterprise workflow solution (Compass AI), and other offerings to drive adoption of affordable, accessible ultrasound. Butterfly also enables third-party development of imaging AI apps through Butterfly Garden, its software development kit and AI marketplace.

In addition to its medical imaging products, Butterfly Embedded is the company’s Ultrasound-on-Chip licensing and co-development business designed to enable a new wave of ultrasound-enabled technologies across non-competitive healthcare markets and beyond. Through Butterfly Embedded, partners can build and scale ultrasound applications powered by Butterfly’s proprietary semiconductor chip and software platform. Butterfly’s innovations have been recognized by Prix Galien USA, Fierce 50, TIME’s Best Inventions, and Fast Company’s World Changing Ideas, among other achievements.