Taiwan Firm Makes MEDICA Debut With Wound Healing Product Exhibit

By Michael Barbella, Managing Editor | 11.15.22

Company's technology has improved product efficacy and halved the amount of chronic wound healing time.

TAICEND TECHNOLOGY Co. Ltd. is making its international debut this week at MEDICA, the world's largest medical trade fair.

The company is joining 46 other Taiwanese medical material manufacturers participating in the four-day show in Düsseldorf, Germany. TAICEND TECHNOLOGY is displaying a series of wound healing products that bring the concept of treatment into the wound healing field. TAICEND TECHNOLOGY's R&D team has developed a new generation of material technology and redefined the former concept in wound care. This has improved product efficacy and halved the amount of chronic wound healing time. The company also provides suitable solutions and products tailored for each customer. In addition to reducing the care and economic burden on family members and patients, it also makes it easier for medical staff to handle the wound well, and is a more effective solution for wound healing.

Due to a growing aging population, many elderly people or those with fragile skin often suffer from skin pressure injuries caused by treatment or medical equipment. This year, TAICEND TECHNOLOGY cooperated with Chi Mei Hospital, a well-known hospital in Taiwan, to develop a series of decompression products.

In addition to the decompression pad of CPAP oxygen mask, the company has launched several new skin decompression products such as an oxygen mask decompression pad; a body decompression pad developed for long-term bedridden patients; a Medical Tube Decompression Pad used for compression injuries; and the Fixing Device Decompression, which uses a fixed plate for intravenous infusion therapy. Three of the products have won awards—one gold medal and two silver medals in the Green Ideas International Invention and Design Competition.

TAICEND TECHNOLOGY is exhibiting at MEDICA in Hall 6, Booth B09-1 through Nov. 17.